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| Data Sheet, V2.1, Oct. 2006 BGF200 Microphone Filter and ESD Protection Small Signal Discretes Edition 2006-10-17 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2006. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF200 BGF200 Revision History: 2006-10-17, V2.1 Previous Version: 2006-03-16 Page All Subjects (major changes since last revision) Layout conformation Data Sheet 3 V2.1, 2006-10-17 BGF200 Microphone Filter and ESD Protection Microphone Filter and ESD Protection Feature * Microphone filter * Integrated ESD protection up to 15 kV * Low input impedance * More than 30 dB stopband attenuation * Ideal for GSM/UMTS * Wafer Level Package with SnAgCu-Bumps WLP-8-1,- 2, -4 A3 B1 C1 B2 B3 C2 C3 A2 BGF200_Blockdiagram.vsd Figure 1 Description Blockdiagram The BGF200 is a microphone filter with low pass characteristic offering a very high stop band attenuation up to 6 GHz. All pins are protected against ESD. The wafer level package is a green package with a size of only 1.6 mm x 1.6 mm and a total height of 0.65 mm. Type BGF200 Table 1 Parameter Voltage at pin A2 to GND Voltage at all other pins to GND Operating temperature range Storage temperature range Summed up input power for all pins Between pins C3 and B3 Between all other pins 1) Contact discharge Package WLP-8-4 Maximum Ratings Marking GF200 Chip N0703 Symbol Min. Values Typ. Max. 4.0 14 +85 +150 25 0 -14 -40 -65 Unit V V C C mW kV kV Note / Test Condition VA2 VP TOP TSTG PIN 1) TA < 70 C Electrostatic Discharge According to IEC61000-4-2 VE VI -15 -2 15 2 Data Sheet 4 V2.1, 2006-10-17 BGF200 Microphone Filter and ESD Protection Table 2 Parameter Electrical Characteristics1) Symbol Min. Values Typ. 2200 50 1000 150 Max. 2310 52.5 1350 200 100 pF pF nA 2090 47.5 800 120 Unit Note / Test Condition Resistors R1, R2, R4 Resistor R3, R5 Capacitances C1,C2,C3,C4 Capacitances C5 Substrate leakage currents all pins to GND R1,2,4 R3,5 C1,2,3,4 C5 I VR = 3 V Insertion loss2) IL 30 dB F = 0.1... 6 GHz, pins C3 to B1, C1 ZS = ZL = 50 1) at TA = 25 C 2)Insertion loss (see also Figure 3) strongly depends upon source and load impedance. For RF test purposes a 50 environment is used. B3, GND1 A3 C3 1n0 C3 R3 50R R1 2k2 B1 C2 1n0 B2, GND2 R2 2k2 C5 150p C1 1n0 C2, GND3 A2 R5 50R C4 1n0 C1 R4 2k2 BGF200_Schematic.vsd Figure 2 Schematic Data Sheet 5 V2.1, 2006-10-17 BGF200 Microphone Filter and ESD Protection Transmission Gain |S21|2 = f(f) -20 |S -30 C3B1 | 2 |SC3C1| -40 2 -50 |S21| [dB] -60 2 -70 -80 -90 -100 2 10 10 4 10 6 10 8 10 10 Frequency [Hz] Figure 3 Transmission C3 - B1, C3 - C1 1.6 0.05 0.65 0.05 0.25 0.05 STAN D OFF 0.08 C 8x C OPLAN AR ITY C 3) 2 x 0.5 = 1 0.1 C C3 C2 C1 B 0.5 B3 B2 B1 A3 A 2 x 0.5 = 1 A2 SEATING PLANE 2) C orner Index Area 0.5 8x o0.05 M A B 0.3 0.051) 1) D imension is measured at the maximum ball diameter, parallel to primary datum C 2) Identified by marking 3) Primary datum C and seating plane are defined by the domed crowns of the balls Figure 4 Package Outline WLP-8-4 4 0.1 0.25 0.1 1.75 0.1 Corner Index Area 1) 1.75 0.1 8 0.1 1.15 0.15 1) Balls face down CWLG9627 Figure 5 Data Sheet Tape for WLP-8-4 6 V2.1, 2006-10-17 0.5 1.6 0.05 |
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